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Chip-scale package
Results: 22

#	Item
11	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 16:24:43 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
12	FlipChip International: I MPLEMENTING TO SUPPORT GROWTH, OBTAIN REAL TIME COMMUNICATION AND RAPID PROBLEM SOLVING An AssurX interview with Sheila Mosher, VP of Information Technology Introduction Add to Reading List Source URL: www.assurx.com Language: English - Date: 2014-08-06 22:09:12 Quality management system Electronics Electronic engineering Semiconductor device fabrication Electronics manufacturing Technology Wafer-level packaging Chip scale package Flip chip Quality assurance
13	H. K. CHARLES jr. Miniaturized Electronics Harry K. Charles Jr. S Add to Reading List Source URL: www.jhuapl.edu Language: English - Date: 2006-09-15 16:02:52 Electronics manufacturing Semiconductor device fabrication Integrated circuits Electrical engineering Flip chip Multi-chip module Three-dimensional integrated circuit Ball grid array Chip scale package Electronics Electronic engineering Electromagnetism
14	Innovative Common Technologies to Support State-of-the-Art Products SMAFTI Package Technology Features Wide-Band and Large-Capacity Memory KURITA Yoichiro, SOEJIMA Koji, KAWANO Masaya Add to Reading List Source URL: www.nec.com Language: English - Date: 2013-10-01 21:40:28 Technology System in package Semiconductor device fabrication Ball grid array System on a chip Chip scale package Interposer Flip chip Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronics
15	Packaging Technology for Image-Processing LSI  Yoshiyuki Yoneda  Kouichi Nakamura Add to Reading List Source URL: www.fujitsu.com Language: English - Date: 2013-02-06 07:16:32 Semiconductor device fabrication Integrated circuits Semiconductor devices Electronic design Electronics manufacturing Flip chip Chip scale package Quad-flat no-leads package System in package Electronic engineering Electronics Technology
16	MICROSYSTEM INTEGRATION AND PACKAGING Advanced Interconnect and Packaging Technologies RTI International is home to one of the premier wafer bumping and wafer-level packaging research and fabrication facilities in the U Add to Reading List Source URL: www.rti.org Language: English - Date: 2014-10-29 13:23:56 Materials science Flip chip Wafer-level packaging Chip scale package Microelectromechanical systems Solder RTI International Reliability Wafer Semiconductor device fabrication Electronics Technology
17	Die Carrier Temporary Reusable Packages S e t t i n g t h e S t a n d a r d s f o r To m o r r ow Die Level Burn-in and Test Add to Reading List Source URL: www.aehr.com Language: English - Date: 2009-03-18 18:13:31 Semiconductor device fabrication Electronics manufacturing Electronic design Electrical engineering Printed circuit board Reliability Flip chip Chip scale package Electronic engineering Electronics Electromagnetism
18	PDF Document Add to Reading List Source URL: material.htlwien10.at Language: English - Date: 2001-07-05 08:47:30 Technology Ball grid array Surface-mount technology Flip chip Tape-automated bonding Integrated circuit Chip scale package Wire bonding Multi-chip module Electronics manufacturing Electronics Electronic engineering
19	PDF Document Add to Reading List Source URL: www.sigrity.com Language: English - Date: 2001-12-06 18:32:34 Semiconductor device fabrication Electronics manufacturing Ball grid array Integrated circuit packaging Capacitor Flip chip Bumpless Build-up Layer Integrated circuit Chip scale package Technology Electronics Electronic engineering
20	PDF Document Add to Reading List Source URL: www.et-trends.com Language: English - Date: 2009-09-24 19:28:26 Electromagnetism Ball grid array Flip chip Surface-mount technology Flexible circuit Printed circuit board Solder Chip scale package Integrated circuit Electronics manufacturing Electronics Electronic engineering